3D-FE electro-thermo-magnetic modeling of automotive power electronic modules -Wire- bonding and Copper clip technologies compar
![Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/98ebbb7ff06d45bc6f8bed1ed24351f510b74a22/2-Figure2-1.png)
Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
![Figure 1 from Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive | Semantic Scholar Figure 1 from Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/07b01db55f68a3b5229756c2e14f98f23ae6bd61/1-Figure1-1.png)
Figure 1 from Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive | Semantic Scholar
![No-Clean Solder Paste for Clip-bonding Die-Attach | Dr. Andy Mackie | Indium Corporation Blogs | Die Attach | No Clean Solder | Voiding No-Clean Solder Paste for Clip-bonding Die-Attach | Dr. Andy Mackie | Indium Corporation Blogs | Die Attach | No Clean Solder | Voiding](http://www.indium.com/blog/media/blogs/0913/smt_and_power_w640.jpeg)
No-Clean Solder Paste for Clip-bonding Die-Attach | Dr. Andy Mackie | Indium Corporation Blogs | Die Attach | No Clean Solder | Voiding
![Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/98ebbb7ff06d45bc6f8bed1ed24351f510b74a22/2-Figure1-1.png)
Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling | Semantic Scholar
![a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram](https://www.researchgate.net/publication/289706872/figure/fig1/AS:319869900869632@1453274335320/a-Cu-wire-bonds-on-an-IGBT-9-b-a-DCB-substrate-with-Al-ribbons-10-and-c-a-Cu.png)